Board size : (with buffer unused) Min. L 50 x W 30 mm to

Max. L 1,330 x W 510 mm

Board thickness : 0.4 - 4.8 mm

Placement speed : (12 heads + 2 theta)

Opt. Cond. : 0.08 sec/CHIP (45,000CPH)

Placement accuracy A (?+3 ) : CHIP +/- 0.040 mm, IC +/- 0.025 mm

Placement angle : +/-180 degrees

Component height : Max. 30 mm *1